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NCP1380BDR2G
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  • NCP1380BDR2G

BD42530EFJ-CE2

Description
Frequency : ROHM
Square :8-SOIC（0.154"，3.90mm Wide）Bare solder pad
Sealed :pmic-Power management-Specialized8-HTSOP-J
Spot Stocks
Inventory:10000
MOQ:2500
Configuration :22+
Standard packaging :2500
Unit price (including 13% tax)
Purchase quantity
The purchase quantity must not exceed the inventory quantity
The purchase quantity must not be less than the minimum order quantity
Unit-Price
$489.00
Total
￥
1222500
Detailed Parameters

Mounting typeSurface mount typeSquare_Casing8-SOIC（0.154″，3.90mm Wide）Bare solder padPackagingStatic（TR）,Shear band（CT）Telecommunications_Function3V ~ 42VOperating temperature-40°C ~ 125°C（TA）SeriesAutomotive, AEC-Q100Dot matrix_Function80µAVendor device packaging8-HTSOP-JMinimum quantity1.0qty0.0ApplicationAutomotive grade

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