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NCP1380BDR2G
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  • NCP1380BDR2G

MC33PF8100EAES

Description
Frequency : NXP
Square :56-VFQFN Bare solder pad
Sealed :pmic-Power management-Specialized56-HVQFN（8x8）
Spot Stocks
Inventory:520
MOQ:2500
Configuration :2Antarctic
Standard packaging :0
Unit price (including 13% tax)
Purchase quantity
The purchase quantity must not exceed the inventory quantity
The purchase quantity must not be less than the minimum order quantity
Unit-Price
$0.00
Total
￥
0
Detailed Parameters

Mounting typeSurface mount，Wettable flankSquare_Casing56-VFQFN Bare solder padPackagingTrayTelecommunications_Function2.7V ~ 5.5VOperating temperature-40°C ~ 105°C（TA）Series–Dot matrix_Function–Vendor device packaging56-HVQFN（8×8）Minimum quantity260.0qty0.0ApplicationBased on high performance i.MX 8，S32x Processor

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